- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 25/00 - Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
Patent holdings for IPC class H01R 25/00
Total number of patents in this class: 1527
10-year publication summary
|
126
|
201
|
193
|
206
|
222
|
192
|
144
|
101
|
85
|
20
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hubbell Incorporated | 3052 |
45 |
| Server Technology, Inc. | 100 |
30 |
| Byrne, Norman R. | 217 |
24 |
| TE Connectivity Solutions GmbH | 2580 |
24 |
| CommScope Technologies LLC | 4937 |
23 |
| Eaton Intelligent Power Limited | 6113 |
20 |
| Molex, LLC | 1792 |
19 |
| Titan3 Technology LLC | 173 |
18 |
| Pass & Seymour, Inc. | 181 |
17 |
| Yazaki Corporation | 6282 |
16 |
| Chien, Aaron | 109 |
16 |
| Chien, Te-ju | 109 |
16 |
| Wang, Hsin-yi | 109 |
16 |
| Apple Inc. | 50209 |
15 |
| Cisco Technology, Inc. | 18858 |
15 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
13 |
| National Products, Inc. | 123 |
12 |
| Zonit Structured Solutions, LLC | 111 |
12 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
11 |
| The Wiremold Company | 148 |
11 |
| Other owners | 1154 |